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Cited article:

Thermal camera for System-in-Package (SiP) technology: Transient thermal analysis based on FPGA and Finite Element Method (FEM)

Aziz Oukaira, Dhaou Said, Idir Mellal, Ouafaa Ettahri, Jamal Zbitou and Ahmed Lakhssassi
AEU - International Journal of Electronics and Communications 172 154980 (2023)