Finite element analysis of mechanical impacts in large imaging detectors

¹ China Electronics Standardization Institute, Beijing 100007, China
² School of Intelligent Engineering and Automation, Beijing University of Posts and Telecommunications, Beijing 102206, China
³ International School, Beijing University of Posts and Telecommunications, Beijing 100876, China

^* Corresponding email:zhanghengwen@bupt.edu.cn

Abstract

This study utilizes Ansys to analyze the stress distribution of a large imaging detector subjected to mechanical impacts, including vibration, shock loading, and collision, encountered during space missions. Employing an axisymmetric model and direct solution method, the study simulates the detector's stress-deformation field. Results indicate that during impact, maximum stresses on both the chip and its adhesive concentrate at the edge region, remaining within safe limits. Furthermore, simulations demonstrate a positive correlation between detector size and stress magnitude. Notably, the adhesive effectively reduces stress concentration at the chip's center. These analyses offer valuable insights for optimizing the detector's structural design and mitigating potential weaknesses during the manufacturing process.