Open Access
| Issue |
ITM Web Conf.
Volume 77, 2025
2025 International Conference on Education, Management and Information Technology (EMIT 2025)
|
|
|---|---|---|
| Article Number | 01046 | |
| Number of page(s) | 7 | |
| DOI | https://doi.org/10.1051/itmconf/20257701046 | |
| Published online | 02 July 2025 | |
- R. Yu, L. Cheng and D. Zhang, "On-Chip Generation Method of Shock Load and Characterization of Microstructure Shock Process," in Journal of Microelectromechanical Systems, vol. 31, no. 4, pp. 712–720, Aug. 2022, doi: 10.1109/JMEMS.2022.3180411. [CrossRef] [MathSciNet] [Google Scholar]
- J. Fan et al., "Fatigue Damage Assessment of LED Chip Scale Packages with Finite Element Simulation," 2018 19th International Conference on Electronic Packaging Technology (ICEPT), Shanghai, China, 2018, pp. 1642–1648, doi: 10.1109/ICEPT.2018.8480748. [CrossRef] [Google Scholar]
- K. Wang. Calculation Formulas For Principal Stresses[J]. Mechanic in Engineering 2014, 36(6): 783–785. DOI: 10.6052/1000-0879-13-502. [Google Scholar]
- Tzu-Hsuan Cheng, H.-C. Cheng, W.-H. Chen, Hsin-Yi Huang and Tao-Chih Chang, "Reliability characterization of 2.5D multi-chip module on board under drop impact," 2014 International Conference on Electronics Packaging (ICEP), Toyama, 2014, pp. 215–218, doi: 10.1109/ICEP.2014.6826691. [CrossRef] [Google Scholar]
- Z. Wang, C. Xie, C. Wang and X. Wang, "Investigation on the Vibration Amplitude of Au Bonding Wire Under Mechanical Shock," 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), Singapore, 2018, pp. 1–4, doi: 10.1109/IPFA.2018.8452563. [Google Scholar]
- C.-S. Lau, N. Ye and H. Takiar, "A Response Spectrum Method and Post-layout Optimization for Mechanical Shock Analysis of 3D NAND BGA Packages," 2018 IEEE CPMT Symposium Japan (ICSJ), Kyoto, Japan, 2018, pp. 1–4, doi: 10.1109/ICSJ.2018.8602610. [Google Scholar]
- J. Gu, W. Xie, C. Guirguis, M. Ahmad and Y. Pang, "System level mechanical shock reliability of BGA packages: Experimental and numerical analysis," 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin, China, 2017, pp. 1163–1168, doi: 10.1109/ICEPT.2017.8046647. [CrossRef] [Google Scholar]
- J. Gu, W. Xie, M. Ahmad and Q. Wang, "Experimentally validated analysis and parametric optimization of mechanical shock testing of advanced BGA packages," 2015 16th International Conference on Electronic Packaging Technology (ICEPT), Changsha, China, 2015, pp. 501–507, doi: 10.1109/ICEPT.2015.7236636. [Google Scholar]
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