ITM Web Conf.
Volume 9, 2017The 2016 International Conference Applied Mathematics, Computational Science and Systems Engineering
|Number of page(s)||4|
|Published online||09 January 2017|
Mathematical model of an integrated circuit cooling through cylindrical rods
1 Department of Informatics and Artificial Intelligence, Faculty of Applied Informatics, Tomas Bata University in Zlín, nám. T. G. Masaryka 5555, 760 01 Zlín, Czech Republic
2 Department of Automation and Control Engineering, Faculty of Applied Informatics, Tomas Bata University in Zlín, nám. T. G. Masaryka 5555, 760 01 Zlín, Czech Republic
* Corresponding author: email@example.com
One of the main challenges in integrated circuits development is to propose alternatives to handle the extreme heat generated by high frequency of electrons moving in a reduced space that cause overheating and reduce the lifespan of the device. The use of cooling fins offers an alternative to enhance the heat transfer using combined a conduction-convection systems. Mathematical model of such process is important for parametric design and also to gain information about temperature distribution along the surface of the transistor. In this paper, we aim to obtain the equations for heat transfer along the chip and the fin by performing energy balance and heat transfer by conduction from the chip to the rod, followed by dissipation to the surrounding by convection. Newton's law of cooling and Fourier law were used to obtain the equations that describe the profile temperature in the rod and the surface of the chip. Ordinary differential equations were obtained and the respective analytical solutions were derived after consideration of boundary conditions. The temperature along the rod decreased considerably from the initial temperature (in contatct with the chip surface). This indicates the benefit of using a cilindrical rod to distribute the heat generated in the chip.
© The Authors, published by EDP Sciences, 2017
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